P. S. Chen

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P. S. S. Chen
Publication record
3 papers · 9 citations · H-index 2

PAPERS

Electrical characterization of through silicon vias (TSVs) with an on chip bus driver for 3D IC integration
20122 citationsauthor #10
Tuesday, 28 August 2012
20121 citationsauthor #3782
Structural design, process, and reliability of a wafer-level 3D integration scheme with Cu TSVs based on micro-bump/adhesive hybrid wafer bonding
20126 citationsauthor #4

TIMELINE

2012 9 citations

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