Cure kinetics and thermal stability of maleimide modified epoxy TGIC/CPE powder coating system

No abstract is available for this paper.

• Publication year

  2015

• Venue

  Thermochimica Acta

• Publication date

  2015-10-10

• Fields of study

  Materials Science

• Identifiers
  DOI 10.1016/J.TCA.2015.09.004
• External record

  Open on Semantic Scholar

• Source metadata

  Semantic Scholar

• No claims are published for this paper.

• No concepts are published for this paper.

• Cure kinetics, thermal stability, and dielectric properties of epoxy/barium ferrite/polyaniline composites

  2015cited by this paper
• Novel silicone–phenyl contained amine curing agent for epoxy resin: 1. Non-isothermal cure and thermal decomposition

  2014cited by this paper
• Curing behavior of epoxy resins in two‐stage curing process by non‐isothermal differential scanning calorimetry kinetics method

  2014cited by this paper
• ICTAC Kinetics Committee recommendations for collecting experimental thermal analysis data for kinetic computations

  2014cited by this paper
• Progress in shape memory epoxy resins

  2013cited by this paper
• Recent developments in the fire retardancy of polymeric materials

  2013cited by this paper
• Synthesis of conductive adhesives based on epoxy resin/nanopolyaniline and chloroprene rubber/nanopolyaniline: Characterization of thermal, mechanical and electrical properties

  2013cited by this paper
• Preparation and characterization of hydrophobic PVDF membranes by vapor-induced phase separation and application in vacuum membrane distillation

  2013cited by this paper
• A study of the thermal, dielectric, and flame-retarding characteristics of various bismaleimide blended with halogen-free epoxy resin

  2013cited by this paper
• Cure mechanism and thermal properties of the phthalide-containing bismaleimide/epoxy system

  2013cited by this paper
• Isothermal cure kinetics of uncatalyzed and catalyzed diglycidyl ether of bisphenol-A/carboxylated polyester hybrid powder coating

  2012cited by this paper
• Preparation and characterization of bismaleimide-triazine/epoxy interpenetrating polymer networks

  2012cited by this paper
• ICTAC Kinetics Committee recommendations for performing kinetic computations on thermal analysis data

  2011cited by this paper
• Method for reducing contact resistivity of carbon nanotube-containing epoxy adhesives for aerospace applications

  2011cited by this paper
• Dynamic cure kinetics and thermal degradation of brominated epoxy resin–organoclay based nanocomposites

  2011cited by this paper
• Improved thermal conductivity of epoxy composites using a hybrid multi-walled carbon nanotube/micro-SiC filler

  2010cited by this paper
• Integral, differential and advanced isoconversional methods: Complex mechanisms and isothermal predicted conversion–time curves

  2009cited by this paper
• Effect of curing on the broadband dielectric spectroscopy of powder coating

  2007cited by this paper
• Thermal properties and water sorption behaviors of epoxy and bismaleimide composites

  2007cited by this paper
• Synthesis and Kinetics Study of Vinyl Ester Resin in the Presence of Triethylamine

  2006cited by this paper
• Isoconversional Kinetic Analysis of Thermally Stimulated Processes in Polymers

  2006cited by this paper
• Gelation and isoconversional kinetic analysis of lignin–phenol–formaldehyde resol resins cure

  2006cited by this paper
• Thermal decomposition, combustion and flame‐retardancy of epoxy resins—a review of the recent literature

  2004cited by this paper
• Maleimide-epoxy resins: preparation, thermal properties, and flame retardance

  2003cited by this paper
• Novel thermosetting resins based on 4-(N-maleimidophenyl)glycidylether I. Preparation and characterization of monomer and cured resins

  2003cited by this paper
• Learning about epoxy cure mechanisms from isoconversional analysis of DSC data

  2002cited by this paper
• Catalysis of the epoxy-carboxyl reaction

  2002cited by this paper
• A study of cure kinetics by the use of dynamic differential scanning calorimetry

  2002cited by this paper
• Synthesis and characterization of siliconized epoxy-1,3-bis(maleimido)benzene intercrosslinked matrix materials

  2002cited by this paper
• Kinetics of esterification of cycloaliphatic epoxies with methacrylic acid

  2002cited by this paper
• Cure characterization of powder coatings

  2001cited by this paper
• Synthesis and thermal characterization of a one component maleimide-epoxy resin

  2001cited by this paper
• Modification of the integral isoconversional method to account for variation in the activation energy

  2001cited by this paper
• Cure kinetics modeling of epoxy resins using a non‐parametric numerical procedure

  2001cited by this paper
• Effect of physical aging and thermal stress on the behavior of polyester/TGIC powder coatings

  2000cited by this paper
• A numerical approach to the modeling of polymer curing in fibre-reinforced composites

  1999cited by this paper
• Powder coatings technology: new developments at the turn of the century

  1998cited by this paper
• Effects of CTBN on the cure characteristics of DGEBA/MDA/PGE-AcAm system

  1998cited by this paper
• Kinetic studies of thermoset cure reactions: A review

  1997cited by this paper
• The ‘Temperature Integral’ — Its use and abuse

  1997cited by this paper
• Comparative study of the cure kinetics of an unsaturated polyester resin using different procedures

  1996cited by this paper
• Investigation on bismaleimide bearing polysiloxane (BPS) toughening of 4,4′-bismaleimido diphenylmethane (BMI) matrix—synthesis, characterization and toughness

  1996cited by this paper
• Influence of the accelerator concentration on the curing reaction of an epoxy-anhydride system

  1995cited by this paper
• The Málek method in the kinetic study of polymerization by differential scanning calorimetry

  1995cited by this paper
• Kinetics of thermoset cure and polymerization in the glass transition region

  1993cited by this paper
• A kinetic analysis of the curing reaction of an epoxy resin

  1993cited by this paper
• The kinetic analysis of non-isothermal data

  1992cited by this paper
• A nonisothermal differential scanning calorimetry study of the curing kinetics of an unsaturated polyester system

  1989cited by this paper
• The effect of some catalysts on the curing of oxiranes with p-phenylenediamine

  1986cited by this paper
• Free radical polymerization models for simulating reactive processing

  1986cited by this paper
• Thermal characterization of polymeric materials

  1981cited by this paper
• Rational approximations of the integral of the Arrhenius function

  1977cited by this paper
• Differential scanning calorimetry of epoxy cure: isothermal cure kinetics☆

  1976cited by this paper
• Analysis of curing kinetics in polymer composites

  1973cited by this paper
• Study of the kinetics of the mechanism of solid-state reactions at increasing temperatures

  1971cited by this paper
• Kinetic analysis of derivative curves in thermal analysis

  1970cited by this paper
• The Application of Differential Thermal Analysis to the Study of Reaction Kinetics

  1967cited by this paper
• General Treatment of the Thermogravimetry of Polymers.

  1966cited by this paper
• A New Method of Analyzing Thermogravimetric Data

  1965cited by this paper
• Reaction Kinetics in Differential Thermal Analysis

  1957cited by this paper
• The Application of Differential Thermal Analysis to the Study of Reaction Kinetics1

  1957cited by this paper

• Improving the quality of thermosetting powder coatings: A review of the characterization methods, material properties, process techniques, and modeling approaches

  2025cites this paper
• Thermogravimetric Analysis of a New Series of Trimellitimide-Based Epoxy-Imide Resins

  2024cites this paper
• Numerical Simulation of Polyacrylamide Hydrogel Prepared via Thermally Initiated Frontal Polymerization

  2024cites this paper
• Investigation of the Isothermal Cure Kinetics of New Series of Bis(Trimellitimide) Derived Epoxy-Imide Resins

  2023cites this paper
• Synthesis of a curing agent containing trifunctional epoxy groups for powder coatings and its curing reaction kinetics

  2022cites this paper
• Comparative study on the curing kinetics and thermal properties of a new series of diglycidyl esters of bis(trimellitimide)s

  2022cites this paper
• Effect of the Phase-Transition Fluid Reaction Heat on Wellbore Temperature in Self-Propping Phase-Transition Fracturing Technology

  2022cites this paper
• Sustainable utilization of corn starch resources: A novel soluble starch-based functional chrome-free tanning agent for the eco-leather production

  2022cites this paper
• Dynamic Cure Kinetics and Physical-Mechanical Properties of PEG/Nanosilica/Epoxy Composites

  2020cites this paper
• Simulation and non-linear optimization of Šesták-Berggren kinetics

  2020cites this paper
• Study on application performance of oxidized polyethylene wax in powder coatings

  2019cites this paper
• Enhancing the potential of employing thermosetting powder recyclates as filler in LLDPE by structural modifications

  2017cites this paper
• Effect of epoxy monomer structure on the curing process and thermo-mechanical characteristics of tri-functional epoxy/amine systems: a methodology combining atomistic molecular simulation with experimental analyses

  2017cites this paper
• Analysis of the Change in Curing Temperatures as a Result of Hydrolysis of Electrostatic Thermosetting Powder Coating Residue

  2016cites this paper