A cost-effective pre-bond functional test architecture for 3D SoCs

No abstract is available for this paper.

• Publication year

  2016

• Venue

  International Conference on Information Communication and Management

• Publication date

  2016-11-01

• Fields of study

  Computer Science, Engineering

• Identifiers
  DOI 10.1109/ICAM.2016.7813601
• External record

  Open on Semantic Scholar

• Source metadata

  Semantic Scholar

• No claims are published for this paper.

• No concepts are published for this paper.

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