Optimal mechanical and thermal architecture of high-conductivity inserts for cooling an electronic piece

No abstract is available for this paper.

• Publication year

  2019

• Venue

  Journal of Thermal Analysis and Calorimetry

• Publication date

  2019-10-01

• Fields of study

  Materials Science, Engineering

• Identifiers
  DOI 10.1007/s10973-019-08275-9
• External record

  Open on Semantic Scholar

• Source metadata

  Semantic Scholar

• No claims are published for this paper.

• No concepts are published for this paper.

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