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Global semiconductor manufacturing equipment trade: a perspective from a complex network

Kai Wang,Peng Peng,Li Yu,Yang Xu,Feng Lu

Published 2025 in Area Development and Policy

ABSTRACT

ABSTRACT The complexity of global trade has led to intricate competition in the semiconductor manufacturing industry. Accurately assessing the trade pattern and competitive relations among countries is difficult when depending on a singular trade category or numerous isolated indicators. In this paper, directed weighted networks are built with the trade data for five categories of equipment from 2012–2022 and some geographically enhanced indicators are presented to investigate the network structure and resilience. Furthermore, a competitiveness assessment model using entropy-base is proposed to examine the spatial distribution and temporal changes of different countries’ trade flows. The findings include: 1) Trade scale and ‘small-world’ characteristics have been strengthened, with 2018 as a turning point, marking an evolution from ‘expansion’ to ‘consolidation’. Network resilience is significantly influenced by key nodes. 2) Global trade has become an oligopolistic structure, highly concentrated in eight key countries – Japan, Singapore, the USA, Germany, the Netherlands, China, the United Kingdom and France. 3) The national competitiveness exhibits a ‘four-tier’ structure. Regionally, Europe, Southeast Asia and East Asia are the most competitive. The Pacific, Africa and parts of South America offer significant potential for further market expansion.

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