Plan-View to Cross-Section Conversion Work-Flow for Defect Analysis

An advanced sample preparation technique is demonstrated on a 3D Fin-FET structure. We present a step-by-step workflow to localize/mark a target structure (defect) in the horizontal plane of the sample and convert it into a vertical cross-section lamella which is inspected with STEM.

• Publication year

  2018

• Venue

  International Symposium on the Physical and Failure Analysis of Integrated Circuits

• Publication date

  2018-07-01

• Fields of study

  Materials Science, Engineering

• Identifiers
  DOI 10.1109/IPFA.2018.8452588
• External record

  Open on Semantic Scholar

• Source metadata

  Semantic Scholar

• No claims are published for this paper.

• No concepts are published for this paper.

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