SCIENCE@home

Assembly of a 3D Cellular Computer Using Folded E-Blocks

Shivendra Pandey,N. J. Macias,Carmen Ciobanu,ChangKyu Yoon,C. Teuscher,D. Gracias

Published 2016 in Micromachines

ABSTRACT

The assembly of integrated circuits in three dimensions (3D) provides a possible solution to address the ever-increasing demands of modern day electronic devices. It has been suggested that by using the third dimension, devices with high density, defect tolerance, short interconnects and small overall form factors could be created. However, apart from pseudo 3D architecture, such as monolithic integration, die, or wafer stacking, the creation of paradigms to integrate electronic low-complexity cellular building blocks in architecture that has tile space in all three dimensions has remained elusive. Here, we present software and hardware foundations for a truly 3D cellular computational devices that could be realized in practice. The computing architecture relies on the scalable, self-configurable and defect-tolerant cell matrix. The hardware is based on a scalable and manufacturable approach for 3D assembly using folded polyhedral electronic blocks (E-blocks). We created monomers, dimers and 2 × 2 × 2 assemblies of polyhedral E-blocks and verified the computational capabilities by implementing simple logic functions. We further show that 63.2% more compact 3D circuits can be obtained with our design automation tools compared to a 2D architecture. Our results provide a proof-of-concept for a scalable and manufacture-ready process for constructing massive-scale 3D computational devices.

PUBLICATION RECORD

CITATION MAP

EXTRACTION MAP

CLAIMS

  • No claims are published for this paper.

CONCEPTS

  • No concepts are published for this paper.

REFERENCES

Showing 1-41 of 41 references · Page 1 of 1

CITED BY

Showing 1-11 of 11 citing papers · Page 1 of 1