{"corpus_id":272249467,"paper_sha":"fa3ec4695008469b416957b54e4dd5fa8ced91f9","doi":"10.1109/TCPMT.2024.3451136","arxiv_id":null,"pmid":null,"pmcid":null,"mag_id":null,"dblp_id":null,"acl_id":null,"title":"Enhanced Junction Temperature Prediction Model for CoWoS Packaging With Multiple Chiplets","year":2024,"publication_date":"2024-10-01","venue":"IEEE Transactions on Components, Packaging, and Manufacturing Technology","journal":{"name":"IEEE Transactions on Components, Packaging and Manufacturing Technology","pages":"1783-1791","volume":"14"},"journal_issn":null,"journal_title":null,"publication_types":["JournalArticle"],"pubmed_pub_types":null,"s2_fields_of_study":[],"reference_count":16,"citation_count":2,"influential_citation_count":0,"is_open_access":false,"arxiv_categories":null,"arxiv_license":null,"arxiv_journal_ref":null,"mesh_headings":null,"chemicals":null,"comments_corrections":null,"source_flags":1,"s2_open_access_pdf_url":null,"s2_open_access_landing_url":null,"s2_open_access_license":null,"s2_open_access_status":null,"pmc_open_access_pdf_url":null,"pmc_open_access_landing_url":null,"pmc_open_access_license":null,"pmc_open_access_status":null,"unpaywall_open_access_pdf_url":null,"unpaywall_open_access_landing_url":null,"unpaywall_open_access_license":null,"unpaywall_open_access_status":null,"abstract":"With the development of high-performance computing and artificial intelligence, the transistor density of systems on a chip is also increasing exponentially, and the packaging solution for future high-performance chips has shifted toward chip-on-wafer-on-substrate (CoWoS) packaging. However, with the complexity of the CoWoS packaging structure and the increase in the number of chips, it is extremely challenging to analyze the steady-state heat of the CoWoS packaging. This is a necessary measure to optimize the chip layout and evaluate the package’s reliability. Based on the heat transfer path from the chip to the environment, an analytical model has been proposed in this study to calculate the temperature of multiple chiplets CoWoS packaging. The thermal coupling between multiple chiplets and the thermal equivalence of the through-silicon via (TSV) interposer are fully taken into account in this model. Each thermal resistance in the packaging has an analytical solution, and each chiplet has a junction temperature calculation expression. To verify the accuracy of the model calculation data, this study uses finite element simulation to calculate the chiplet temperature for two cases under two sets of thermal conditions. The data show that this model has high accuracy and fast calculation speed for temperature calculation of CoWoS multiple chiplet packaging.","claims":[{"public_id":"cl_b589140e7ec50759168bb4fbf2f8fbca","status":"active","text":"An analytical junction-temperature model was developed for multiple-chiplet CoWoS packaging.","confidence":0.99,"contributors":[{"id":1,"public_id":"12632b8b5f","public_label":"Anonymous (12632b8b5f)","roles":["extraction"],"url":"https://sah.borca.ai/u/12632b8b5f"}],"url":"https://sah.borca.ai/claims/cl_b589140e7ec50759168bb4fbf2f8fbca"},{"public_id":"cl_88c28301acab775949e4658380360a35","status":"active","text":"Each thermal resistance in the package has an analytical solution, and each chiplet has a junction-temperature expression.","confidence":0.96,"contributors":[{"id":1,"public_id":"12632b8b5f","public_label":"Anonymous (12632b8b5f)","roles":["extraction"],"url":"https://sah.borca.ai/u/12632b8b5f"}],"url":"https://sah.borca.ai/claims/cl_88c28301acab775949e4658380360a35"},{"public_id":"cl_fc3d33e92694f406d5cde4b118cab099","status":"active","text":"Finite element simulation on two cases under two thermal-condition sets shows high accuracy and fast calculation speed for the proposed model.","confidence":0.94,"contributors":[{"id":1,"public_id":"12632b8b5f","public_label":"Anonymous (12632b8b5f)","roles":["extraction"],"url":"https://sah.borca.ai/u/12632b8b5f"}],"url":"https://sah.borca.ai/claims/cl_fc3d33e92694f406d5cde4b118cab099"},{"public_id":"cl_046f7afc91f87caa1603616a65684b46","status":"active","text":"Thermal coupling among multiple chiplets and the thermal equivalence of the TSV interposer are incorporated in the temperature model.","confidence":0.95,"contributors":[{"id":1,"public_id":"12632b8b5f","public_label":"Anonymous (12632b8b5f)","roles":["extraction"],"url":"https://sah.borca.ai/u/12632b8b5f"}],"url":"https://sah.borca.ai/claims/cl_046f7afc91f87caa1603616a65684b46"}],"concepts":[{"public_id":"co_28024955ac4bb97ce13592d368e32d8a","status":"active","name":"finite element simulation","description":"A numerical simulation method used to verify the model's temperature predictions.","types":["simulation method"],"aliases":["FEM"],"contributors":[{"id":1,"public_id":"12632b8b5f","public_label":"Anonymous (12632b8b5f)","roles":["extraction"],"url":"https://sah.borca.ai/u/12632b8b5f"}],"url":"https://sah.borca.ai/concepts/co_28024955ac4bb97ce13592d368e32d8a"},{"public_id":"co_287b71de469fae99fd81202191506cc8","status":"active","name":"high performance computing","description":"Computing workloads requiring high processing capability and often motivating advanced chip packaging.","types":["application domain"],"aliases":["HPC"],"contributors":[{"id":1,"public_id":"12632b8b5f","public_label":"Anonymous (12632b8b5f)","roles":["extraction"],"url":"https://sah.borca.ai/u/12632b8b5f"}],"url":"https://sah.borca.ai/concepts/co_287b71de469fae99fd81202191506cc8"},{"public_id":"co_2f9e046d840e37b230c09753a6907188","status":"active","name":"analytical model","description":"A closed-form heat-transfer model used to calculate chiplet temperatures in the packaging structure.","types":["method"],"aliases":[],"contributors":[{"id":1,"public_id":"12632b8b5f","public_label":"Anonymous (12632b8b5f)","roles":["extraction"],"url":"https://sah.borca.ai/u/12632b8b5f"}],"url":"https://sah.borca.ai/concepts/co_2f9e046d840e37b230c09753a6907188"},{"public_id":"co_8e4081bc9f70a8d01960b4ffa925c149","status":"active","name":"thermal resistance","description":"A resistance term representing heat-flow opposition in the package's thermal network.","types":["parameter"],"aliases":[],"contributors":[{"id":1,"public_id":"12632b8b5f","public_label":"Anonymous (12632b8b5f)","roles":["extraction"],"url":"https://sah.borca.ai/u/12632b8b5f"}],"url":"https://sah.borca.ai/concepts/co_8e4081bc9f70a8d01960b4ffa925c149"},{"public_id":"co_96716ed7c50a869e10754cf1540bc53d","status":"active","name":"junction temperature","description":"The temperature at the chiplet junction, used as the target quantity for thermal analysis.","types":["measurement"],"aliases":[],"contributors":[{"id":1,"public_id":"12632b8b5f","public_label":"Anonymous (12632b8b5f)","roles":["extraction"],"url":"https://sah.borca.ai/u/12632b8b5f"}],"url":"https://sah.borca.ai/concepts/co_96716ed7c50a869e10754cf1540bc53d"},{"public_id":"co_a3775797cad342f5c3de232531d59b8d","status":"active","name":"thermal coupling","description":"Mutual thermal influence among neighboring chiplets within the package.","types":["phenomenon"],"aliases":[],"contributors":[{"id":1,"public_id":"12632b8b5f","public_label":"Anonymous (12632b8b5f)","roles":["extraction"],"url":"https://sah.borca.ai/u/12632b8b5f"}],"url":"https://sah.borca.ai/concepts/co_a3775797cad342f5c3de232531d59b8d"},{"public_id":"co_e0b9e34a42df695d37a0641320e2b249","status":"active","name":"through-silicon via interposer","description":"A TSV-based interposer that provides vertical electrical and thermal pathways in the package.","types":["component"],"aliases":["TSV interposer","through-silicon via","TSV"],"contributors":[{"id":1,"public_id":"12632b8b5f","public_label":"Anonymous (12632b8b5f)","roles":["extraction"],"url":"https://sah.borca.ai/u/12632b8b5f"}],"url":"https://sah.borca.ai/concepts/co_e0b9e34a42df695d37a0641320e2b249"},{"public_id":"co_eedddd4607b82bc3a06d8182d892affb","status":"active","name":"artificial intelligence","description":"AI workloads that motivate high-density chip packaging in the abstract's setting.","types":["application domain"],"aliases":["AI"],"contributors":[{"id":1,"public_id":"12632b8b5f","public_label":"Anonymous (12632b8b5f)","roles":["extraction"],"url":"https://sah.borca.ai/u/12632b8b5f"}],"url":"https://sah.borca.ai/concepts/co_eedddd4607b82bc3a06d8182d892affb"},{"public_id":"co_ff88c71f426adaa68d5de6842484b321","status":"active","name":"multiple chiplets CoWoS packaging","description":"A chip-on-wafer-on-substrate package containing multiple chiplets.","types":["packaging technology"],"aliases":["CoWoS packaging","CoWoS multiple chiplet packaging"],"contributors":[{"id":1,"public_id":"12632b8b5f","public_label":"Anonymous (12632b8b5f)","roles":["extraction"],"url":"https://sah.borca.ai/u/12632b8b5f"}],"url":"https://sah.borca.ai/concepts/co_ff88c71f426adaa68d5de6842484b321"}],"external_ids":{"DOI":"10.1109/TCPMT.2024.3451136","ArXiv":null,"PubMed":null,"PubMedCentral":null,"MAG":null,"DBLP":null,"ACL":null},"open_access":{"is_open_access":false,"pdf_url":null,"landing_url":"https://sah.borca.ai/papers/272249467","source":null,"pdf_url_source":null,"license":null,"reason":"pdf_url_not_indexed"},"reference_availability":{"status":"available","references_indexed":true,"full_text_available":false,"full_text_source":null,"count_basis":"semantic_scholar_metadata","extraction_status":"not_applicable","reason":null},"source":{"provider":"episteme2","base_corpus":"semantic_scholar_dump","freshness_mode":"unknown","basis":["semantic_scholar_metadata","postgres_metadata"],"limits":["paper metadata is based on indexed upstream scholarly datasets","claims and concepts are available only for extracted papers","absence of claims or concepts means no extracted graph data is available in this response"],"status":"available","degraded":false,"degraded_reasons":[],"diagnostics":{"status":"available","degraded":false,"degraded_reasons":[],"metadata_status":"available","graph_status":"available","abstract_status":"available"},"source_flags":1},"paper_id":630559,"paper_uid":"114cc032-ba7a-480c-b1d8-4484352c4fd6","canonical_identity":{"paper_id":630559,"paper_uid":"114cc032-ba7a-480c-b1d8-4484352c4fd6","identity_status":"available","lookup_basis":"semantic_scholar_external_id","compatibility_path":"corpus_id"},"url":"https://sah.borca.ai/papers/272249467"}