{"corpus_id":46852873,"paper_sha":"a4cfcf46b0f222c743e2eec6cdf3d816743615bd","doi":"10.1016/j.ultsonch.2017.12.004","arxiv_id":null,"pmid":29429689,"pmcid":null,"mag_id":2775042961,"dblp_id":null,"acl_id":null,"title":"Copper electroplating of PCB interconnects using megasonic acoustic streaming.","year":2018,"publication_date":"2018-04-01","venue":"Ultrasonics sonochemistry","journal":{"name":"Ultrasonics sonochemistry","pages":"\n          434-444\n        ","volume":"42"},"journal_issn":null,"journal_title":null,"publication_types":["JournalArticle"],"pubmed_pub_types":["Journal Article"],"s2_fields_of_study":["Medicine","Materials Science","Engineering"],"reference_count":49,"citation_count":24,"influential_citation_count":0,"is_open_access":true,"arxiv_categories":null,"arxiv_license":null,"arxiv_journal_ref":null,"mesh_headings":null,"chemicals":null,"comments_corrections":null,"source_flags":5,"s2_open_access_pdf_url":"https://discovery.dundee.ac.uk/files/56547406/1_s2.0_S1350417717305679_main.pdf","s2_open_access_landing_url":"https://www.semanticscholar.org/paper/287fcf94ac1831f5fbb16faacec971dcb2384942","s2_open_access_license":"CCBYNCND","s2_open_access_status":"GREEN","pmc_open_access_pdf_url":null,"pmc_open_access_landing_url":null,"pmc_open_access_license":null,"pmc_open_access_status":null,"unpaywall_open_access_pdf_url":null,"unpaywall_open_access_landing_url":null,"unpaywall_open_access_license":null,"unpaywall_open_access_status":null,"abstract":"In this research experimental and simulated analysis investigates the influence of megasonic (MS; 1 ± 0.05 MHz) acoustic-assisted electroplating techniques, with respect to the fabrication of through-hole via (THV) and blind-via (BV) interconnects for the Printed Circuit Board (PCB) industry. MS plating of copper down THV and BV interconnects was shown to produce measurable benefits such as increased connectivity throughout a PCB and cost savings. More specifically, a 700% increase of copper plating rate was demonstrated for THVs of 175 µm diameter and depth-to-width aspect ratio (ar) of 5.7:1, compared with electrodeposition under no-agitation conditions. For BVs, a 60% average increase in copper thickness deposition in 150 µm and 200 µm, ar 1:1, was demonstrated against plating under standard manufacturing conditions including bubble agitation and panel movement. Finite element modelling simulations of acoustic scattering revealed 1st harmonic influence for plating rate enhancement.","claims":[{"public_id":"cl_026cb28abada494f4e7502fb46379dfd","status":"active","text":"A 60% average increase in copper thickness deposition was demonstrated for blind vias with 150 µm and 200 µm diameters and 1:1 aspect ratio compared with standard manufacturing conditions including bubble agitation and panel movement.","confidence":0.98,"contributors":[{"id":1,"public_id":"12632b8b5f","public_label":"Anonymous (12632b8b5f)","roles":["extraction"],"url":"https://sah.borca.ai/u/12632b8b5f"}],"url":"https://sah.borca.ai/claims/cl_026cb28abada494f4e7502fb46379dfd"},{"public_id":"cl_c7a43f676addb8a38fe0e2cd64475bec","status":"active","text":"A 700% increase in copper plating rate was demonstrated for through-hole vias with 175 µm diameter and a 5.7:1 depth-to-width aspect ratio compared with electrodeposition under no-agitation conditions.","confidence":0.98,"contributors":[{"id":1,"public_id":"12632b8b5f","public_label":"Anonymous (12632b8b5f)","roles":["extraction"],"url":"https://sah.borca.ai/u/12632b8b5f"}],"url":"https://sah.borca.ai/claims/cl_c7a43f676addb8a38fe0e2cd64475bec"},{"public_id":"cl_737e316c4ec3f71fecce2d1e49e9429b","status":"active","text":"Finite element modelling of acoustic scattering indicates that the first harmonic contributes to plating rate enhancement.","confidence":0.92,"contributors":[{"id":1,"public_id":"12632b8b5f","public_label":"Anonymous (12632b8b5f)","roles":["extraction"],"url":"https://sah.borca.ai/u/12632b8b5f"}],"url":"https://sah.borca.ai/claims/cl_737e316c4ec3f71fecce2d1e49e9429b"},{"public_id":"cl_401004103f54ccba3611ec0ad5996c73","status":"active","text":"Megasonic acoustic-assisted copper electroplating produces measurable benefits for PCB interconnect fabrication, including increased connectivity and cost savings.","confidence":0.9,"contributors":[{"id":1,"public_id":"12632b8b5f","public_label":"Anonymous (12632b8b5f)","roles":["extraction"],"url":"https://sah.borca.ai/u/12632b8b5f"}],"url":"https://sah.borca.ai/claims/cl_401004103f54ccba3611ec0ad5996c73"}],"concepts":[{"public_id":"co_490a08cd51840540a587b6f5bdd93874","status":"active","name":"copper plating rate","description":"The rate at which copper is deposited during electroplating.","types":["measurement"],"aliases":[],"contributors":[{"id":1,"public_id":"12632b8b5f","public_label":"Anonymous (12632b8b5f)","roles":["extraction"],"url":"https://sah.borca.ai/u/12632b8b5f"}],"url":"https://sah.borca.ai/concepts/co_490a08cd51840540a587b6f5bdd93874"},{"public_id":"co_5ca7db8500d2ac40a85263259403ddf0","status":"active","name":"blind-via","description":"A plated via that connects an outer layer to one or more inner layers without passing through the entire board.","types":["device 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