Copper wirebond pull test and reliability characterization with finite element simulation

No abstract is available for this paper.

• Publication year

  2011

• Venue

  2011 IEEE 13th Electronics Packaging Technology Conference

• Publication date

  2011-12-01

• Fields of study

  Materials Science, Engineering

• Identifiers
  DOI 10.1109/EPTC.2011.6184378
• External record

  Open on Semantic Scholar

• Source metadata

  Semantic Scholar

• No claims are published for this paper.

• No concepts are published for this paper.

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