Realistic non-destructive testing of integrated circuit bond wiring using 3-D X-ray tomography, reverse engineering, and finite element analysis

No abstract is available for this paper.

• Publication year

  2018

• Venue

  Microelectronics and reliability

• Publication date

  2018-04-01

• Fields of study

  Materials Science, Computer Science, Engineering

• Identifiers
  DOI 10.1016/j.microrel.2018.02.015
• External record

  Open on Semantic Scholar

• Source metadata

  Semantic Scholar

• No claims are published for this paper.

• No concepts are published for this paper.

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